Hello, Community! Thinking what would be the most effective way to connect the devices shown in the below topology (two X460s in the access layer connecting to one X670 in the distribution).
1. One approach would be to interconnect them via EAPS domain. However, if this would scale of up to 20 domains on the X670 (up to 40 access layer switches), wouldn't that make some operating / managing issues ?
2. Other option - stacking the X460s in the daisy chain (only option because of the 10Gb uplinks) is not recommended, because the loss of the link between them makes for all sorts of troubles (double masters, etc.).
3. Maybe you would recommend some other solution that would be more resilient and scallable ?